Wafer bevel evaluation technology
Established a method for high-precision component evaluation using sensitivity and quantification-focused SIMS (D-SIMS)!
The component evaluation of the wafer bevel area is generally conducted using TEM or TOF-SIMS; however, both of these methods have limitations in sensitivity and quantification, making it difficult to evaluate trace components. By using a newly developed dedicated fixture, we have established a method for high-precision component evaluation using sensitivity- and quantification-focused SIMS (D-SIMS). Please feel free to contact us when needed. 【Technical Overview】 ■ Fixed with a dedicated fixture to prevent positional shifts of samples in an unstable tilted state and to reduce detection stability issues. ■ Measurement positions can be selected with high precision and flexibility. *For more details, please download the PDF or feel free to contact us.
- Company：東芝ナノアナリシス
- Price：Other
